Study of Control Mechanism for Fluidic Self-Assembly
碩士 === 國立清華大學 === 微機電工程研究所 === 93 === The Pick and Place technology is very popular in the electronics packaging. However, as the component dimension shrinks down dramatically, not only the packaging cost will be sky high and it also creates some problems in the process feasibility and component rel...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/91152988184386228196 |