The Effects of Self-Assembled & Anti-Sticking Layer on Inserting Mold in Nanoimprint Lithography

• Main Authors: Sheng-Yu Chuang, 莊勝佑
• Other Authors: Chih-Wei Wu
• Format: Others
• Language: zh-TW
• Published: 2005
• Online Access: http://ndltd.ncl.edu.tw/handle/56056899506620428705

碩士 === 國立臺灣海洋大學 === 機械與輪機工程學系 === 93 === Nanoscale structures fabricating by photolithography technique will cost a lot and have a light diffraction limit. It would be a great challenge if we could do it by more effectively, namely by a fast, simple and stable method. Nanoimprint lithography (NIL) presented by Stephen Chou in 1995 could be the one of methods in which a stamp is need to press into polymer material to arrive it. Yet, this technology could not be need widely because it has some problems such as sticking. In order to solve the polymer sticking problem on mold, we deposited several kinds of the anti-stiction self-assembled monolayer (SAM).The process parameter included temperature, humidity, solvent and different kind of silane. After pressing on several times up to 17 time, we examined the resident volume sticking on the mold. Based on the research results, we concluded that the anti-SAM will increase in sizes and height when temperature increased. In thermal stability research, we find that the contact angle of the anti-SAM will decrease by temperature raising. In resident analysis, we find that small sizes of the pattern will be resident less than big ones. Temperature at 25 degree and humidity at 20 percent sinking in the toluene and FDTS vapor phase deposition process parameters would get a good quality of imprint by pressing times analysis. For a high temperature process, It is suitable for FDTS to use an anti-layer because it can stand high temperature up to 500 degree. It may be a good choice for researcher requiring a high temperature process. Keywored：NIL; Anti-sticking layer; Resident; Contact angle