Application of Microcontact Printing to the Electroless Plating for the Fabrication of Microscale Metal Patterns
碩士 === 國立臺灣大學 === 化學工程學研究所 === 93 === ABSTRACT Autocatalytic electroless copper plating is widely applied in the printed circuit board industry. In this study, the micro-contact printing technique is applied to directly fabricate the seeding layer for electroless deposition on glass substrate. Now,...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/52396175111918486692 |