| Summary: | 碩士 === 國立臺灣大學 === 應用力學研究所 === 93 === Due to the improvement of semiconductor manufacturing techniques, the quantities and densities of electric components on a single chip increase quickly. The heat dissipated of miniaturized make chips to be operated in higher temperature which will decrease not only the speed of electric components but also the stability of the chips. Taking the CPU, “Intel Pentium 4 Processor Extreme Edition on 0.13 Micron Process in the 775-land Package” published in 2004 for example, its thermal design power can reach about 109.6 Watt. To remove heat generated inside an operating chip becomes more and more important from now on.
The most popular electric cooling devices are fins and fans now, but those devices face the critical point of the ability to transfer heat from local hot spot. In 2004 Intel slows down their new products of CPU, and can not find a suitable device to provide cooling is one of the reasons. Heat pipe is one of the well known cooling devices, and some of them have been integrated with Notebook cooling module. Since Cotter suggest that Micro Heat Pipe could a new electric cooling device in the future, experiments and researches are proposed at the past 20 years. However, the research about how the working fluid inside micro heat pipes still have a lot of issues to be worked out.
In this experiment I fabricate micro heat pipe chip using surface machining and bulk machining of MEMS manufacturing. The the channel of micro heat pipe is 150μm in width, and 15mm in length. This is the first time to fabricate a micro heat pipe chip integrated with micro heater and In-situ micro temperature sensor array. I hope that this research can promote the development of the electric cooling industry.
There are four subjects in this experiment: First, integrated micro heater and micro heat pipe and micro temperature sensors in one single chip; Second, combining the glass chip and silicon chip using anodic bonding and epoxy pasting; Third, filling working fluid in a convenient way; Fourth, analyzing the behavior of the micro heat pipe under different applied works.
I use micro heater to simulate hot spot, and use micro heat pipe as a cooling device to find out the performance of this design. Chip_0 which no working fluid is filled burned out when 800mW is applied on the heater; however, Chip_1 and Chip_2 which is filled several working fluids can work when 1W is applied on the heater. Then, gravity and heat sink are use to improve the performance of the micro heat pipe, and both of them are workable. Although the maximum thermal conductivity of Chip_1 and Chip_2 are about 8.333 and 4.545 W/mK, but they improve the maximum thermal conductivity about 3 to 5times than Chip_0.
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