Failure analysis of solder joint on PCB board
碩士 === 國立臺灣科技大學 === 機械工程系 === 93 === In electronic packaging industry, it’s an important issue to estimate the reliability of the package. The strength of solder joint can influence the performance of products effectively. While the adhesive strength is not strong enough, the delamination may occur...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/51079190304699614932 |