Failure analysis of solder joint on PCB board

碩士 === 國立臺灣科技大學 === 機械工程系 === 93 === In electronic packaging industry, it’s an important issue to estimate the reliability of the package. The strength of solder joint can influence the performance of products effectively. While the adhesive strength is not strong enough, the delamination may occur...

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Bibliographic Details
Main Authors: LAI, YUAN-YI, 賴垣伊
Other Authors: 趙振綱
Format: Others
Language:zh-TW
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/51079190304699614932

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