Evaluation of Ta-Ni amorphous thin film properties for copper metallization in integrated circuits
碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 93 === This study prepared Ta-Ni thin films deposited on p-type (100) Si substrate and on silica substrates by a magnetron dc sputtering system, aimed at evaluating a high crystallization temperature and a low resistivity barrier film for Cu metallization in integr...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/4c548y |