Using Nanoindentation to Measure the Mechanical Properties of Photoresist Thin Films at Various Temperature

碩士 === 聖約翰技術學院 === 自動化及機電整合研究所 === 93 === This study uses nanoindentation to measure the mechanical properties of photoresist thin films associated with a indentation simulation by way of the finite element method. The SU8 photoresist is coated on the silicon wafer with various spin coating speed. T...

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Bibliographic Details
Main Authors: Yang Pao Hsiang, 楊寶翔
Other Authors: Rwei Ching Chang
Format: Others
Language:zh-TW
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/11947560496826506278