Using Nanoindentation and Nanoscratach to Measure the Mechanical Properties of Evaporation Thin Films

碩士 === 聖約翰技術學院 === 自動化及機電整合研究所 === 93 === This study uses nanoindentation and nanoscratch to measure the mechanical properties of the evaporation aluminum and copper thin films in association with a nanoindentation simulation by way of the finite element method. The thin film is accumulated on the s...

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Bibliographic Details
Main Authors: SUN, CHANG-EN, 孫長恩
Other Authors: CHANG, JUI-CHING
Format: Others
Language:zh-TW
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/07076587448464355985