The application of fabrication on flip chip solder bump and RF probe card by using micro-electroplating and polishing technologies
碩士 === 國立臺北科技大學 === 自動化科技研究所 === 93 === The micro-electroplating process is the only method that can fabricate metallic micro-structures speedy in the LIGA/MEMS technology. This kind of deposition method is characterized by manufacturing high aspect ratio and complex 3D structures easily, resulting...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/32zemv |