| Summary: | 碩士 === 國立臺北科技大學 === 自動化科技研究所 === 93 === The micro-electroplating process is the only method that can fabricate metallic micro-structures speedy in the LIGA/MEMS technology. This kind of deposition method is characterized by manufacturing high aspect ratio and complex 3D structures easily, resulting in lowering process cost and meeting market requirements.
The quality and uniformity of the plated micro-structures, however, is frequently influenced by some factors such as pattern design, pattern allocation, pattern location, aspect ratio, compositions in the plating solution and current distribution during plating process. In order to acquire uniform thickness and smooth roughness after plating, we employ a polishing process to improve its quality and uniformity before stripping the photoresist.
The work of this study is to combine the micro-electroplating process with the polishing process on the fabrication of complex 3D microstructures. There are two focuses in this study. Firstly, we use a polishing process to polish plating-based flip chip solder bumps by which we can obtain high uniformity thickness no matter before and after reflow process. Afterward we are expected to have high assembly yield rate by precisely controlling the uniformity before reflow within 2.5 um on the solder bumps with 55 um height across the entire 4 inch wafer and the height uniformity after reflow can obtain as accurate as up to 4％ as a whole. On the other hand, using multi-layer micro-electroplating technology along with the same polishing process, we can fabricate high RF probe card featuring with high precision in dimension, excellent performance in high frequency and low cost in process as well.
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