Advanced oxidation process (AOP) for removing COD from the effluent of the semiconductor industrial plant
碩士 === 淡江大學 === 水資源及環境工程學系碩士班 === 93 === Chemical Mechanical Polishing (CMP) is the most efficient planarization process in manufacturing wafers for integrated circuits manufacturing, planarizing and polishing wafer surface by chemical etching and mechanical polishing. However, CMP process consums l...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36413074510079349574 |