Fabrication and Test of Micro Fuses
碩士 === 淡江大學 === 機械與機電工程學系碩士班 === 93 === In this study, a micro copper fuse was developed on glass epoxy plate by wet etching technology. The fuse structure has a length of 600μm and a width of 80μm.The thickness of the copper layer is 30μm. Numerical simulation was studied with ANSYS software to p...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/60764962587153562385 |