Using Neural Networks and Immune Algorithms to Find the Optimal Parameters for IC Wire Bonding Processes
碩士 === 國立雲林科技大學 === 工業工程與管理研究所碩士班 === 93 === The wire bonding process is the key process in an IC chip-package. It is an urgent problem for IC chip-package industry to improve the wire bonding process capability. In this study, an application of artificial neural networks (ANN) and artificial immune...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/87731192832536559968 |