A Study of Using Machine Vision to Measure Bubble Flaws on Microwave Communication Substrates
碩士 === 元智大學 === 工業工程與管理學系 === 93 === In the process of manufacturing Microwave Communication Substrates, Company A currently bonded the substrate by soldering a heat sink. The advantage of using such approach is that the company can choose different materials to achieve better cooling effects. Howe...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/95748871943737160291 |