A study in Using Machine Vision to Inspect the 2D/3D Geometries of the BGA Solder Balls
碩士 === 元智大學 === 機械工程學系 === 93 === With the function of today’s IC becomes more complicate than ever before, the I/O counts also increased dramatically. With the increase of the surface packaging density, the development of the Ball Grid Array (BGA) packaging with solder balls as signal connections h...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/25485433106178816434 |