Analysis and Inprovement of photomasks During Baking Process

碩士 === 元智大學 === 機械工程學系 === 93 === In this paper, the variations of temperature, resist thickness and critical dimension (CD) across the photomasks during baking process have been investigated by experiments. The temperature uniformity of the masks becomes worse when the gap between the mask and the...

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Bibliographic Details
Main Authors: Shuen-Jen Cheng, 鄭順仁
Other Authors: Yur-Tsai Lin
Format: Others
Language:zh-TW
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/49360510895304361349