Stresses and Strength at Material Interfaces in Optic-Electronic Package
碩士 === 長庚大學 === 機械工程研究所 === 94 === The purpose of this study is to investigate the stress analysis and failure behavior of the optic-electronic package, molded with three different molding-compounds (M.C.s), under thermal cycle test (TCT). First, the failure modes of package after TCT are documented...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/92664152503220421868 |