Dynamic Bottleneck Finite Capacity Planning: A Study of Flip Chip Substrate Production
碩士 === 中原大學 === 工業工程研究所 === 94 === In this research, a capacity planning system is proposed for a flip chip substrate plant. Four modules are developed: Orders Analysis Module, Orders Selection Module, Workload Accumulation Module, and Workload Balance Module. Order Analysis Module analyzes the ca...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/23391238925103591527 |