Grinding Characteristics and Process Parameter Study of Silicon Wafer
碩士 === 大葉大學 === 機械工程研究所碩士班 === 94 === Manufacturing of silicon wafers begins with growing silicon ingots and slicing these ingots into wafers by wire sawing. The sliced wafers have to go through many processes before they can be used for various applications. The surface grinding of silicon wafer is...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/73965699970579405233 |