Grinding Characteristics and Process Parameter Study of Silicon Wafer
碩士 === 大葉大學 === 機械工程研究所碩士班 === 94 === Manufacturing of silicon wafers begins with growing silicon ingots and slicing these ingots into wafers by wire sawing. The sliced wafers have to go through many processes before they can be used for various applications. The surface grinding of silicon wafer is...
Main Authors: | LOU, SHAO-WEI, 羅紹威 |
---|---|
Other Authors: | Chi, Hua-Wei |
Format: | Others |
Language: | zh-TW |
Published: |
2006
|
Online Access: | http://ndltd.ncl.edu.tw/handle/73965699970579405233 |
Similar Items
-
Studies on grinding characteristics of silicon wafer thinning process
by: I-Hsuan Lin, et al.
Published: (2006) -
Effecs of Grinding Parameters on the Subsurface Damage of Silicon Wafer
by: WANG SHIH HUN, et al.
Published: (2007) -
Modeling and Predicting of Surface Roughness of Silicon Wafer Grinding
by: Zhang Jenwei, et al.
Published: (2007) -
Application on Silicon Wafer Grinding Process Performance Enhancement
by: Chi-Hsu Tu, et al.
Published: (2004) -
Ultra Precision Grinding of Silicon Wafers
by: Hung Yi Huang, et al.
Published: (2003)