Improve IC Chemical Mechanical Polishing Process Quality through the Six Sigma Approach
碩士 === 逢甲大學 === 工業工程與系統管理學研究所 === 94 === To pursuit miniature continuously has been the trend for IC manufacturing through tiny components such as transistors, leading wires, along with improving circuit from quadratic to cube dimension on the wafer to approach higher integration level and rapider d...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/98960254268900070775 |