Guiding TPM activities to promote the OEE of equipment for the forming machine in semiconductor package industry
碩士 === 逢甲大學 === 工業工程與系統管理學研究所 === 94 === In recent years, the semiconductor of Taiwan encapsulated industry''s fast development, the capability utilization ratio of the equipment has already become one of the most important topics that administrators have paid attention to. The manufacture...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/32020750297725439529 |