A Study of Die Saw Parameter Design for IC Packaging Flip Chip Process
碩士 === 逢甲大學 === 工業工程與系統管理學研究所 === 94 === The development of IC assembly in recent years has focus on fast, multifunctional, high reliability and minimizing the IC, and having a higher density component and high pin count in the same time, Flip Chip was introduced and soon to be the most dominant ass...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/41623043952225175945 |