Molding Analysis of the IC Package Wire-Sweep
碩士 === 逢甲大學 === 材料與製造工程所 === 94 === This research paper concentrates on the simulation of the mold compound filling process for IC package after Wire Bonding. Two different IC packages are used: One is LQFP 64 IO and the other is TFBGA 196 I/O. The simulation results were compared and verified with...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/82219526550068201016 |