A Numerical Study of the Warpage in IC Packaging by Taguchi Method
碩士 === 逢甲大學 === 機械工程學所 === 94 === In the process of IC packaging, there are some problems about wire sweep、paddle shift and warpage…,etc. In the recorders, there are many research-reports about wire sweep and paddle shift while there are few in warpage about IC package. As the type of IC package...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/89242815434898156461 |