Using Taguchi Method to Optimize the Parameters of Plasma Process on Lead-Frame Property Improvement
碩士 === 華梵大學 === 機電工程研究所 === 94 === Wire bonding and flip chip are the two main interconnecting technologies of electric packaging to interconnect IC chip with substrate or lead-frame to transfer electric signal. This paper aims at improving the wire bonding between the wire and lead-frame by the use...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/69582914551436290311 |