Extracting the Young's Moduli and Residual Stresses of Thin Films from the C-V Measurement of the Micro Test-key

碩士 === 華梵大學 === 機電工程研究所 === 94 === This thesis presents a novel and high-precision technology for extracting the Young’s modulus and Residual stress of thin films through measuring the capacitance-voltage variation of micro test-key at wafer level. Since the driving and response signals are all elec...

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Bibliographic Details
Main Authors: Bo-Yuan Huang, 黃柏元
Other Authors: Yuh-Chung Hu
Format: Others
Language:zh-TW
Published: 2006
Online Access:http://ndltd.ncl.edu.tw/handle/87468233578684023258