The Study of Wire-Bond Defect Analysis in IC Packaging based on Automation Optical Inspection System
碩士 === 義守大學 === 資訊工程學系碩士班 === 94 === The technology IC packaging covers not only the applications physics, chemistry, machinery, and electrical machinery, but also used various materials like metal, ceramics and so on. In promoting the competitor of IC manufacturing, the use of AOI in is important,...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/00060634151987627458 |