Parametric Study and Optimal Design for mini Stack-Die Package in Wire Bonding Process
碩士 === 義守大學 === 電子工程學系碩士班 === 94 === The purpose of this research is to study the parametric factors and optimal design for wire bond process up to 4-layer stack die package, and utilize the finite element method to simulate the bond pull as well as ball shear tests. A series of experiments have bee...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/01340798732933375498 |