Effect of Temperature Test on the Interface of Organic Solderability Preservative Ball Pad and Lead-free Solder Ball
碩士 === 義守大學 === 電子工程學系碩士班 === 94 === Reliability test always is an important index for new product release in IC Assy. manufactory. The temperature test results influence actual product operation and market demand. For the request of environment protection, lead-free material is one of the most impo...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/68231681054876442576 |