Application of Submodeling Technique to Transient Drop Impact Analysis of Board-level Stacked-Die Package
碩士 === 義守大學 === 機械與自動化工程學系碩士班 === 94 === The objective of this research is to develop a finite element model to predict the board-level dynamic drop test for polymer-based substrate 4-layer stack die packages. The most vulnerable area in BGA package has been found at solder joint when it is subjecte...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/78723265134805768208 |