Optimal Design on Fatigue Life of Multichip Package Using Hybrid Model
碩士 === 國立成功大學 === 工程科學系碩博士班 === 94 === Multichip module (MCM) mainly is a mode of discrete chips needed in the system and assembled in a module in order to shorten the distance among chips and reduce the signal delay so that to save space, enhance the speed of performance, decrease the power dissi...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/68951600861710384417 |