Feasibility of Using Adhesion Force as a Parameter for IC Package Mold Design
碩士 === 國立成功大學 === 工程科學系碩博士班 === 94 === In integrated circuit (IC) packaging, when epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion effects occurs in the interface between EMC and mold surface. Adhesion effects can cause many problems. For example, too large a...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/32868971228118165707 |