Bondability of Wire Bonding for Overhang Stacked Die with Viscoelastic Die Attach Film
碩士 === 國立成功大學 === 工程科學系碩博士班 === 94 === Portable electrical products are trended to light、thin、short and merge more functions into a single package. To reduce the required space for packages and developed time for chips, 3D electronic packages are evolued to meet the requests of market. This paper fo...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/49255859593978893543 |