A Study of Solder Joint Structure in QFN Package
碩士 === 國立成功大學 === 工程科學系專班 === 94 === QFN package consists of various components. When the package suffers a temperature cycling load as the different coefficients of thermal expansion（CTE）of those components, it will tend to deform and lead to fatigue of solder joint. For this reason, the effects on...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/37727153035274251756 |