Study of wire bonding process forNiPdAu PPF leadframe

碩士 === 國立成功大學 === 工程科學系專班 === 94 === Because of the growing environmental consciousness, NiPdAu PPF leadframe that eliminates plating process of plastic package is already used widely in semiconductor industry at present, as a green products component. The research is to study crescent bonding bond...

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Bibliographic Details
Main Authors: Yu-Ping Lin, 林煜斌
Other Authors: Jung-Hua Chou
Format: Others
Language:en_US
Published: 2006
Online Access:http://ndltd.ncl.edu.tw/handle/56213024364721947837