Study of wire bonding process forNiPdAu PPF leadframe

• Main Authors: Yu-Ping Lin, 林煜斌
• Other Authors: Jung-Hua Chou
• Format: Others
• Language: en_US
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/56213024364721947837

碩士 === 國立成功大學 === 工程科學系專班 === 94 === Because of the growing environmental consciousness, NiPdAu PPF leadframe that eliminates plating process of plastic package is already used widely in semiconductor industry at present, as a green products component. The research is to study crescent bonding bondability on the inner finger of NiPdAu PPF leadframe. Through Taguchi methods and analysis of variance are used to evaluate related matters that influence crescent bonding bondability including thickness condition of NiPdAu, capillary dimension, gold wire type, process condition, bonding parameter. The software packages JUMP and MINITAB are used to analyze through the course of the experiment. In the mean time, the bonding formation of gold crescent bond on the inner finger of NiPdAu PPF leadframe is also examined. Thus, metal microstructure and surface morphology of NiPdAu PPF leadframe which might influence crescent bonding bondability on the inner finger can be understood. Through this study, an optimized bonding process to achieve good crescent bond bondability is obtained.