Study of wire bonding process forNiPdAu PPF leadframe
碩士 === 國立成功大學 === 工程科學系專班 === 94 === Because of the growing environmental consciousness, NiPdAu PPF leadframe that eliminates plating process of plastic package is already used widely in semiconductor industry at present, as a green products component. The research is to study crescent bonding bond...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2006
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/56213024364721947837 |