The Effect of Different Cu Concentration on the Microstructure and Mechanical Property of Lead –Free Sn-Ag-Cu-Sb Solder
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 94 === Abstract In this study, the liquid of tin and copper plate were diffused at 270oC for 100 hours to investigate micro-structures, wettability and mechanical properties of lead-free solder Sn-3.0Ag-0.5Cu-0.2Sb when the concentration of copper was increased...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/83108420240558085852 |