Investigation on the Interfacial Stability of Copper/Tantalum Nitride/Dielectrics Multilayered Systems

博士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 94 === In this study, the characteristics of various Cu/Ta-N/dielectric /<Si> structures before and after heat treatment were explored. Dielectric materials with low dielectric constants used in this study were fluorinated silicate glass (FSG) and organosili...

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Bibliographic Details
Main Authors: Ching-Chun Chang, 張景鈞
Other Authors: Jen-Sue Chen
Format: Others
Language:zh-TW
Published: 2006
Online Access:http://ndltd.ncl.edu.tw/handle/53194692128455136559