The Microstructure and Low Cycle Fatigue of Sn-Ag-Sb-xIn Lead-Free Solder Joints
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 94 === The goal of this research is to evaluate the effect of In additions (0~10 wt%) on the melting point and microstructure of Sn-Ag-2Sb lead-free solder. The reliability of low cycle fatigue of the solder joint is estimated by the thermal storage test for 150˚C. S...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/05100375183025276109 |