Failure Mechanism of Electromigration for Flip-Chip SnAg3.5 Solder Joints
博士 === 國立交通大學 === 材料科學與工程系所 === 94 === Electromigration behavior of lead-free SnAg3.5 solder joints was investigated under the average current densities of 1 �e 104 A/cm2 and 5 �e 103 A/cm2 at 150℃. Different failure modes were observed for the above two stressing conditions. When stressed at 1 �e...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/08288625847433983410 |