Investigations on Damascene Process for ULSI Interconnects
博士 === 國立交通大學 === 材料科學與工程系所 === 94 === In semiconductor manufacturing, as device dimensions continue shrinking into deep sub-micro regime, high packing density Cu multilevel interconnection technology has been developed due to its lower resistance and parasitic capacitance for increasing ULSI operat...
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| Format: | Others |
| Language: | en_US |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/55011726231624919685 |