Electromigration of SnPb flip chip solder bumps with thick Ni/Cu under bump metallization
碩士 === 國立交通大學 === 材料科學與工程系所 === 94 === Flip Chip Technology is one of the most important packaging methods for high current density IC device. While current density applied increased, solder joint has become a critical issue on device reliability. Concerning electromigration, the device design rule...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/01929528302074238570 |