Effect of Aging on Electromigration of Flip-Chip Solder Joints
碩士 === 國立交通大學 === 材料科學與工程系所 === 94 === Due to the trend of miniaturization and the high performance, the dimension of solder bumps keeps decreasing and the current that each bump needs to carry keeps increasing, causing the current density in the solder bump to increase dramatically. As a result of...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/47698226891013304180 |