Study of Nano-scale Copper Metallization on Damascene Process Integration for Semiconductor Integrated Circuits
博士 === 國立交通大學 === 材料科學與工程系所 === 94 === With semiconductor manufacture shrunk down to the 100 nm technology, the interconnection of the device would be faced to the nano-scale manufacturing and integration. The nano-scale interconnection could reduce the high power consumption and heat accumulation,...
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| Format: | Others |
| Language: | en_US |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/69376191632345128800 |