Studies on Dry Etch of Low Dielectric Constant Nanoporous Silica Thin Films

碩士 === 國立交通大學 === 材料科學與工程系所 === 94 === Due to the rapid increase in transistor density and the operation speed of an IC chip, the ultralarge-scale integrated circuit (ULSI) has an urgent demand for scaling down the device size, and thus the dimension of the interconnect accordingly. Consequently, t...

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Bibliographic Details
Main Authors: Ji-Feng Liu, 劉吉峰
Other Authors: Fu-Ming Pan
Format: Others
Language:zh-TW
Published: 2006
Online Access:http://ndltd.ncl.edu.tw/handle/37393144934146257011