An Investigation into the Characteristics of Electromigration Failure Mechanisms in Copper Interconnects
博士 === 國立交通大學 === 電子工程系所 === 94 === The back-end-of-line (BEOL) RC delay has gradually become a major limiting factor in circuit performance as a result of the rapid shrinking of critical dimensions. With reduced resistivities and dielectric constants, the metallization system for the interconnect s...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2006
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/11166491923422808302 |