Coupling Effects between Two Interfacial Soldering Reactions in Flip-Chip Solder Joint
博士 === 國立中央大學 === 化學工程與材料工程研究所 === 94 === Abstract It has been reported that as Ni and Cu bond pads are soldered to form a joint, Sn/Ni and Sn/Cu interfacial reactions would interact mutually, as reviewed in chapter 1. The dissolved Cu atoms from the Cu pad would move toward the Ni pad, then, a Cu-...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/72v4w8 |